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118期

Professor Beng Ong

作者:  發(fā)布:2014-09-12 00:00:00  點(diǎn)擊量:

報(bào)告題目Towards Printed Electronics - Challenges and Advances in Materials Development

報(bào) 人:Professor Beng Ong (香港浸會(huì)大學(xué))

報(bào)告時(shí)間:2014912945

報(bào)告地點(diǎn):化學(xué)樓二樓一號(hào)會(huì)議室

報(bào)告人及報(bào)告簡(jiǎn)歷

Professor Ong received his BSc from Nanyang University, PhD from McGill University, and did his postdoctoral studies at Harvard University before joining Xerox. He is presently the Director of Research Centre of Excellence for Organic Electronics, Deputy Director of Institute of Creativity, and Chair Professor in Materials Science at Hong Kong Baptist University. He has published extensively on advanced materials and processes, nanotechnology and emerging electronic technologies, and has over 10,000 citations and an H-index of 57.

Abstract: Printed electronics offers excellent opportunities for creating novel impactful large-area, lightweight, flexible, and stretchable electronics. To realize this technology vision, manufacture of semiconductor devices by high-speed printing, instead of traditional photolithographic processes, would be paramount. Printed electronics is innovative, potentially very low-cost, and is an eco-friendlier manufacturing approach to a wide spectrum of next-generation electronics including those with inspiring architectural design. Foremost among critical enablers to propel this paradigm shift in manufacturing is a performance-enabling materials suite of compatible semiconductor, conductor and dielectric materials for fabricating functionally-capable transistors - the fundamental building blocks of modern microelectronics. This presentation discusses the challenges and advances in materials development for printed electronics over the last decade and the outlook for this emerging technology moving forward. Particular emphasis will be devoted to advances in polymer semiconductor design with the field-effect mobility progressing from gross performance deficiency (<< 10-2cm2V-1s-1) a decade ago to more than meeting application requirements (>10cm2V-1s-1) today, together with excellent device shelf-life and operational stability characteristics.

 

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